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Series C-HH-03

Vapor Chamber / Isothermal Plate

A vacuum chamber with a wick and working fluid that pulls heat off components by evaporation and condensation — and spreads it evenly across the plate.

Machined and plated thermal plate with pocketed cavities

≥ 3,000 W/m·K

Equivalent thermal conductivity

≤ 5 °C

Temperature uniformity

−45 to +80 °C

Operating temperature

17 °C cooler

Than a standard sink · 3.96 kW case

Overview

Even temperature across the whole plate.

An internal capillary wick, one-piece welded construction and vacuum charging and sealing — with the outline made to order. Its heat-transfer capability and stable structure suit aerospace, space, electronics and marine applications.

Design advantages

  • Advanced wick structure for rapid vapor return and stability
  • Lightweight and thin profile for integration into compact systems
  • Uniform temperature control even under localized heat loads
  • Vacuum brazed or friction-stir welded

Technical specifications

Standard ranges — built to your requirement.

Values marked customizable can be changed to suit your application; outline and mounting are made to order.

Technical specifications

Operating temperature−45 to +80 °C
Working fluidAcetone, deionized water and others
Cooling typePhase-change
ConstructionVacuum brazing, friction stir welding
Equivalent thermal conductivity≥ 3,000 W/m·K
Temperature uniformity≤ 5 °C
MaterialAluminum, copper or titanium alloy
OutlineMade to order

Gallery

Vapor Chamber / Isothermal Plate in detail.

Long vapor-chamber heat sink with dense fins

Long vapor-chamber heat sink

Copper vapor-chamber heat sink with spring-loaded mounting

Copper vapor-chamber heat sink

Vapor-chamber heat sinks

Same envelope, cooler devices.

Vapor-chamber heat sink with machined fins

Case 01 · 4 × 50 W

200 W module heat sink

100 × 90 × 28 mm, 6063 aluminum with acetone, 40 °C ambient. Peak device 63.9 °C — 11.7 °C cooler than a conventional sink of the same size.

Large finned vapor-chamber heat sink

Case 02 · 6 × 660 W

3.96 kW power-stage heat sink

300 × 200 × 40 mm, 6063 aluminum with acetone, 45 °C ambient. Peak device 119.2 °C — 17.2 °C cooler than a conventional sink of the same size.

Applications

Where it runs.

Satellite thermal control

Phase-change spreading in space hardware.

Semiconductor test equipment

Uniform temperature under the device.

HPC and data centers

Spreading hot spots on processors and power stages.

Precision optical instruments

Isothermal mounting for optics.

Specify your vapor chamber / isothermal plate.

Send the operating conditions and envelope. An engineer will recommend a configuration or quote a custom build.