Series C-HH-02
Liquid-Cooled Enclosure
The liquid-cooled enclosure includes internal coolant channels that circulate liquid to remove heat from electronic modules.
The welded frame provides mechanical strength and excellent electromagnetic shielding.
It meets ATR and MCU rugged chassis standards and supports both VITA-standard and custom modules.
Liquid-Cooled Enclosure
Design Advantages
– Compact design integrating structural and cooling functions
– Sealed frame structure for vibration and corrosion resistance
– High electromagnetic compatibility (EMC) shielding performance
Applications
– Avionics and radar processing units
– Rugged embedded computer systems
– Ground and naval defense electronics
– Industrial automation controllers
Technical Specifications
| Parameter | Value |
|---|---|
| Operating Temperature | −55 °C ~ +90 °C |
| Cooling Medium | Coolant, deionized water, etc. |
| Cooling Type | Side-wall, module, or hybrid circulation |
| Manufacturing Method | Vacuum brazing, friction stir welding, embedded copper tube, deep-hole drilling |
| Working Pressure | 2.5 MPa |
| Material | Aluminum alloy, copper alloy, titanium alloy, stainless steel |